?

産品技術

Products

封裝品種

您當前位置:首頁|産品技術|封裝品種

 
DIP series

Production Overview

 

   DIPDual-In-line packages have been an industry standard for a long time. The applications are common in consumer products, automotive devices, memory, analog ICs, and microcontrollers. These packages have evolved into a state-of-the-art technology owing to their robust reliability and great improvement on performance. Using TH ( through hole) and assembly, DIP provide an assortment of packaging capabilities, especially in low pin count devices at competitive manufacturing costs.

 

Key Features

 


 PKG TYPE

DIP300mil

DIP400mil

DIP600mil

DIP750mil

Lead Count

8~24

28/32

24/28/42/48/52

64/88

LF Material

Cu

Cu

Cu

Cu

Body Width

(mm) * (mm)

7.62

10.16

15.24

19.05/19.50

Body Thickness

3.30

3.30/3.80

3.81

3.80

Lead pitch (mm)

2.54/1.778

1.778

2.54/1.778

1.778/1.27


(1mm=39.37mil; 1mil=25.4um)
* The width of DIP is the distance of shoulder-to-shoulder.


 

Reliability Test Standards

The test criterion is zero defect out of 77 sampling units.


Temp/Humidity Test

85°C/ 85% RH,  JEDEC 22- A101

Pressure Cooker Test

121°C/ 100% RH/ 15 PSIG, JEDEC 22- A102

Temp Cycle Test

-65 ~ 150°C, JEDEC22-A104

High Temp Storage Test

150°C, JEDEC 22- A103

High Accelerated Stress Test

130°C/ 85% RH/ 33.5 PSIA, JEDEC 22- A110/A118


 

 

?

CopyRight 2015 All Right Reserved Tongfu Microelectronics Co., Ltd.
地址:江苏省南通市崇川路288号 电 话:0513-85058888 传 真:0513-85058868
備案號:蘇ICP備05003519號

友情链接:捷豹彩票网址  金凤凰彩票登录  大有彩票注册  博金彩票网站  优优彩票平台  满堂彩彩票登录  乐聚彩票平台  天禧彩票网址  澳洲彩票注册  鼎龙彩票